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Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
Pages: 36
Publication date: 2018-01-23
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Publication date: 2016-09-27
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Pages: 48
Publication date: 2013-10-10
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FL
Pages: 34
Publication date: 2012-12-11
Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Pages: 41
Publication date: 2012-10-02
Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Pages: 40
Publication date: 2011-11-22
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
Pages: 37
Publication date: 2011-06-08
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Pages: 53
Publication date: 2011-01-27
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Pages: 21
Publication date: 2010-08-30
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
Pages: 28